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Zero Defects Achieved with Billions & Billions of Perfect Solder Joints
Challenge: How do you make billions of solder joints with 100% reliability so that your product can dominate a market?
Solution: To IBM's management on the PowerPC project, rework due to poor solder joints just wouldn't allow them to win in the competition for market space against Intel.
Most manufacturers of hybrid edge clips design flaws into their products that result in a significant number of joint failures in the soldering process. They neglect to have the solder bearing feature in contact with the mating surface.
Die-Tech's patented solder laden edge clips stamped on an 0.5 millimeter pitch, with selective gold plated tails, allowed IBM to attain zero soldering defects in their leaded version of the PowerPC.
Zero defects for billions and billions of solder joints. How many of your products are rejected or reworked because of a poorly designed metal stamping that was the lowest price of three bids?
Perhaps it is time to work with a company that will help you take a second look to increase your yields? Call our engineering hotline -- 1.888.89.STAMP -- to explore the possibilities.
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Die-Tech
295 Sipe Road
York Haven, PA 17370
Phone: 717-938-6771
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