Solder and Plating Selection Guide Many leadframes and edge clips have a surface finish applied in order to:   Protect the base material from corrosion.   Aid in the surface wetting characteristics of the device during subsequent assembly operations.   Provide an electrically conductive pathway through the surface of the part. Over 150 active plating codes exist at Die-Tech due to the unique requirements of each program. Rather than list all the specific options that have worked for others, these summary tables will help guide you in selecting the finish that fits your needs. Common Solder Alloy Sn10/Pb90 Sn30/Pb70 Sn60/Pb40 Sn63/Pb37 Sn90/Pb10 Sn100 Concerned with RoHS compliance?  Die-Tech does offer several solder and/or plating options that meet those requirements. The balance of the lead is finished in one of two manners: 1.) Post-Plate - leadframe to which the surface finish is applied after the stamping process is completed. Generally, an electroplate process is utilized. Stamped product will have all surfaces coated with the electrodeposit. This process increases the manufacturing cycle and cost. It does yield a premium product for demanding applications that require all surfaces of the part to be coated. 2.) Pre-Plate - product to which the surface finish is applied before the stamping operation is completed. Stamped product will have bare edges after stamping process. Whether electroplated or hot tin dipped processes are selected, this process is less expensive that post-plating and has shorter manufacturing cycles if the application can tolerate bare edges. Solder is used to adhere the leadframe or edge clip to your component and/or solder pad.   The solder required for this process can be applied using solder paste or via a wave solder operation.  Solder selection is based on the temperature profile. In Die-Tech's patented process solder is bonded directly to the raw material prior to the stamping process so that the perfect amount of solder is available in the clip area for reflow. Thus ensuring a perfect solder filet every time. Solder selection is based on the temperature profile of your entire production process.    The chart below offers common solder alloy combinations and the temperature of their liquid and solid states. Alloy Solid C Liquid C Solid F Liquid F AISn62/Pb36/Ag2    179 189 354 372 Sn63/Pb37 183 183 361 362 Sn60/Pb40 183 193 361 374 Sn90/Pb10 183 216 361 421 Sn95/Pb5 221 245 430 473 Sn10/Pb90 268 302 514 576 Sn10/Pb88/2Ag 268 299 514 570 Would it make sense to have help in the selection of plating or solder to fit your specific application? Manufacturers of custom lead-frame, edge clips, and connectors for the automotive, telecommunications, electronics, medical, military and aerospace industries. Die-Tech Home Precision Metal Stamping Stamping Solutions Prototypes Design Guide Terminal Leadframes Leadframe & Edge Clips Material  Selection Guide Solder Selection Guide Glossary New Technology Quality Certification Newsletters Directions Site Map Contact Us About Us 295 Sipe Road York Haven, PA 17370 Phone: 717.938.6771 Fax: 717.938.6099 Stamping@die-tech.com www.die-tech.com www.die-tech.org © 2007 die-tech, inc. All Rights Reserved.    Site maintenance: Stride-R-Web Services Lead-frame, hybrid edge clips and connectors are designed for the electronics, aerospace, medical, military, telecommunications, and automotive industries. Manufacturers of custom lead-frames, edge clips, and connectors focus on tight tolerance, precision, fine-pitch metal stampings. Die-Tech covers USA, Canada, UK, South America, Mexico, Asia and Europe.